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ET Limited
Showing 1 - 9 of 9, total 1 pages [First] [Previous] [Next] [Last]
1
connect pcb assembly
Specification: PCB Assembly
Detail: Complete products contract PCB assembly and manufacturing services - Strong sourcing ability in relative parts and components - Active and passive components source is directly from original manufacturer - High-precision ...
2
power supply pcba
Specification: PCB Assembly
Detail: Complete products contract PCB assembly and manufacturing services - Strong sourcing ability in relative parts and components - Active and passive components source is directly from original manufacturer - High-precision ...
3
card-read device pcba
Specification: PCB Assembly
Detail: Complete products contract PCB assembly and manufacturing services - Strong sourcing ability in relative parts and components - Active and passive components source is directly from original manufacturer - High-precision ...
4
pcb assembly
Specification: PCB Assembly
Detail: Complete products contract PCB assembly and manufacturing services - Strong sourcing ability in relative parts and components - Active and passive components source is directly from original manufacturer - High-precision ...
5
high tg pcb
Specification: High Tg PCB
Detail: Base material: FR4, FR1, FR2, CEM-1, CEM-3 Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Min...
6
multilayer pcb
Specification: Multilayer PCB
Detail: Base material: FR4, FR1, FR2, CEM-1, CEM-3 Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Min...
7
multilayer pcb
Specification: Multilayer PCB
Detail: Base material: FR4, FR1, FR2, CEM-1, CEM-3 Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Min...
8
halogen free pcb
Specification: halogen free pcb
Detail: Base material: FR4, FR1, FR2, CEM-1, CEM-3 Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Min...
9
printed circuit board
Specification: Multilayer PCB
Detail: Base material: FR4, FR1, FR2, CEM-1, CEM-3 Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask Min...
Showing 1 - 9 of 9, total 1 pages [First] [Previous] [Next] [Last]
1
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